Micron Solder Powder

<ol id="ztxvt"></ol>

<font id="ztxvt"><th id="ztxvt"></th></font>

<ol id="ztxvt"><sub id="ztxvt"></sub></ol>

<ins id="ztxvt"><sub id="ztxvt"></sub></ins>

<ol id="ztxvt"><th id="ztxvt"><p id="ztxvt"></p></th></ol><ins id="ztxvt"><sub id="ztxvt"><p id="ztxvt"></p></sub></ins>

<ol id="ztxvt"></ol>

Oxygen-free copper

Solder Preforms

Flux/Thinner/Cleaner

High Precision Copper Profiles

Lead-free Solder paste

Halogen-free Solder paste

Tin Lead Solder paste

Low Silver High Reliability solder paste

High Strength Solder paste

Jetting Solder Paste

Solder Pastes for Laser Soldering

Micron Solder Powder

Micron Solder Powder

Lead-free Solder paste

Halogen-free Solder paste

Tin Lead Solder paste

Low Silver High Reliability solder paste

High Strength Solder paste

Jetting Solder Paste

Solder Pastes for Laser Soldering

Micron Solder Powder

Micron Solder Powder

PRODUCT SELECTION

DETAILED INTRODUCTION

PRODUCT LIST

Features and Benefits

· Applied to 0.3mm picth bonding pad.

· Type 5 solder powder (10～25 µm) can be used for 0402 components soldering.

· Excellent printability.

· Good heat-resistance and wetting properties.

Applications

Smartphone, Smartwatch.

PRODUCT LIST

Model
ZSRG01
ZSPG01

Alloy	Size	Features&Application
Sn-3Ag-0.5Cu Sn-1Ag-0.5Cu Sn-0.3Ag-0.8Cu	Type5（15~25um）/Type6（5~15um）	/
63Sn-37Pb 55Sn-45Pb 62.8Sn-36.8Pb-0.4Ag	Type5（15~25um）/Type6（5~15um）	/

18以下不能看的色禁网站 <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <蜘蛛词>| <文本链> <文本链> <文本链> <文本链> <文本链> <文本链>