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            SCIENTIFIC RESEARCH
            Research Achievement

            "Scientific research and innovation, layout of the future" is the foundation of Zhongshi in the first place in the industry and the expansion of territory. Since its establishment, Zhongshi has continuously attracted outstanding scientific research talents, created a research and development elite team led by doctoral supervisors and complete levels, and equipped with high-end research and development laboratories, so that Zhongshi products from research and development to demonstration testing, and then to batch listing to form a scientific and rigorous management system. At the same time, Zhongshi has achieved fruitful scientific research results, contributed a number of important patented products to the industry, and is a national standard drafting unit.

            The invention relates to a silver-plated palladium alloy microsphere conductive adhesive and a preparation method thereof

            Patent Number: CN200810180480.9

            A high reliability low temperature lead-free solder paste and its preparation method

            Patent Number: CN201610276455.5

            A water-based cleaning agent can reduce the emission of pollutants in the cleaning of circuit boards

            Patent Number: CN201410158283.2

            A cleaning agent that can remove frosty residue from circuit boards

            Patent Number: CN201410156472.6

            A water-based soldering flux that can reduce the emission of pollutants during tin welding

            Patent Number: CN201310238354.5

            A solid flux with cored solder wire that reduces flight

            Patent Number: CN201310239732.1

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            A halogen-free flux for lead-free solder paste and its preparation method

            Patent Number: CN201210574561.3

            A multicomponent eutectic lead-free solder of Sn-Zn-Bi and its preparation method

            Patent Number: CN201210018765.9

            A water cleaning flux for lead-free soldering and its preparation method

            Patent Number: CN200910148739.6

            A copper surface protectant for lead-free printed circuit board and its preparation method

            Patent Number: CN200910131311.0

            A water-based no-clean flux with no volatile organic compounds, no halogen and low solid content

            Patent Number: CN200610078040.3

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